Self-installing connections for rack liquid cooling

ABSTRACT

A self-installing connector for a liquid cooling system of a datacenter component rack system. A datacenter component rack may include manifolds for conveying coolant to or from one or more datacenter electronic components for liquid cooling components of the datacenter electronic component. The self-installing connector provides a fluid connection between the manifold and a liquid cooling system of a datacenter electronic component. The self-installing connector may puncture the manifold at the time the datacenter electronic component is installed. The self-installing connector may form an opening in the manifold and secure one end of the self-installing connector into the opening upon installation of the datacenter electronic component into the datacenter component rack. The self-installing connector can separate at a dripless quick-disconnect coupling for datacenter electronic component maintenance.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a Continuation of U.S. patent application Ser. No.16/363,165, filed Mar. 25, 2019, now U.S. Pat. No. 10,701,838 issuing onJun. 30, 2020, and entitled “SELF-INSTALLING CONNECTIONS FOR RACK LIQUIDCOOLING,” which is incorporated herein by reference in its entirety.

BACKGROUND

A datacenter typically contains a collection of datacenter electroniccomponents such as computer servers and components for the management,operation and connectivity of those datacenter electronic components.Even in isolation, these datacenter electronic components may generatesufficient heat that temperature management is important for prolongingthe life of the datacenter electronic components and ensuring smooth andcontinuous operation of the datacenter. Typically, such datacenterelectronic components are installed equipped with onboard coolingequipment, such as heat sinks and fans or even liquid cooling systemsattached to components that produce the most heat, like processors.

Datacenter electronic components are often arranged together. Forexample, datacenter electronic components can be vertically arranged inracks or within cabinets. Datacenter cooling systems often include aircooling of individual datacenter electronic components, for example bycirculating air through the casings of respective rack-mounteddatacenter electronic components. Alternatively, or in combination withair cooling, heat rejection of rack-mounted datacenter electroniccomponents can be achieved by direct liquid cooling of components of thedatacenter electronic components.

BRIEF DESCRIPTION OF THE DRAWINGS

Various embodiments in accordance with the present disclosure will bedescribed with reference to the drawings, in which:

FIG. 1 is a partial perspective view of a datacenter component rack andassociated components illustrating an example environment forimplementing a self-installing connector in accordance with embodiments;

FIG. 2 illustrates a detail view of a rear portion of the datacentercomponent rack and components of FIG. 1 showing self-installingconnectors;

FIG. 3 illustrates a section view of an example self-installingconnector inserted into a manifold;

FIG. 4 illustrates a side view of the self-installing connector of FIG.3 before insertion into the manifold;

FIG. 5 illustrates a side view of the self-installing connector of FIGS.3 and 4, advanced so that the self-installing connector is inserted intothe manifold;

FIG. 6 illustrates a side view of the self-installing connector of FIG.5, with a component coupling retracted so that the manifold coupling isdisconnected at a quick-disconnect connector after insertion into amanifold.

DETAILED DESCRIPTION

Embodiments and techniques described herein are directed toself-installing connectors for liquid cooling, which are configured toself-install in a structure such as a coolant supply manifold. Wheninstalled, the self-installing connector provides a fluid connectionbetween a manifold of a cooling system built into and/or included with adatacenter component rack and a datacenter electronic componentinstalled on the datacenter component rack. The self-installingconnector is designed to puncture the manifold as the datacenterelectronic component is installed into a slot of the datacentercomponent rack. As the self-installing connector is installed, amanifold coupling of the self-installing connector is embedded in themanifold. The component coupling of the self-installing connector ispermanently and/or securely attached to the datacenter electroniccomponent. The component coupling and the manifold coupling are coupledtogether through a quick-disconnect coupling. After the manifoldcoupling has been embedded in the manifold, the quick-disconnectcoupling allows the component coupling and the electronic equipment tobe retracted from the datacenter component rack for maintenance and/orother operations and easily re-installed without requiring a separateaction by the installer to couple the liquid cooling system. In otherwords, installation of the datacenter electronic component into thedatacenter component rack also simultaneously accomplishes installationof a quick-disconnect coupling between the datacenter electroniccomponent and the datacenter component rack liquid cooling system.

Because embodiments described herein allow installation of datacenterelectronic components via puncturing of a manifold, the datacenterelectronic components can be installed at varying non-uniform and/orrandom positions along the height of the datacenter component rack. Insome examples, the datacenter component rack may be configured toreceive datacenter electronic components of varying sizes for example asmeasure in rack units (RU), including but not limited to heights of 1unit (1 RU), ½ unit (0.5 RU), and larger heights, or to receiveirregularly-sized datacenter electronic components. At least some priordatacenter component racks included a regular spacing ofquick-disconnect connectors extended from a manifold, each spaced toreceive a single datacenter electronic component. In cases whereelectronic components of mixed heights are installed in the same rack,only a portion of the quick-disconnect connectors might be used.Techniques of the present disclosure may result in cost savings byreducing or eliminating unused connectors in the rack.

In the description herein, various embodiments will be described. Forpurposes of explanation, specific configurations and details are setforth in order to provide a thorough understanding of the embodiments.However, it will also be apparent to one skilled in the art that theembodiments may be practiced without the specific details. Furthermore,well-known features may be omitted or simplified in order not to obscurethe example being described.

FIG. 1 illustrates a partial perspective view of a datacenter componentrack and associated components illustrating an example environment forusing a self-installing connector in accordance with embodiments. Thedatacenter component rack system 100 includes a datacenter componentrack 106 designed to accommodate a plurality of datacenter electroniccomponents. The datacenter component rack 106 may be designed to acceptdatacenter electronic components at varying locations, heights, and/orof varying sizes. In the example shown in FIG. 1, at least two differentsizes of datacenter electronic components are displayed. For instance, adatacenter electronic component 102 located at a top of the datacentercomponent rack 106 is of a first size, which may be sized according to arack unit (RU) size system to be any size, such as ½ RU and/or 1 RU. Adatacenter electronic component 124 is shown which may be of the samesize or RU as the datacenter electronic component 102 or may be of adifferent size. A datacenter electronic component 104 is shown having alarger size, such as 1½ RU or 2 RU. Other electronic datacentercomponents 126 may have larger sizes in according to some examplesand/or be distributed vertically throughout the datacenter componentrack 106. Other datacenter electronic components (not shown) may beinstalled in the datacenter component rack 106. The datacenterelectronic components 102, 104, and 124 may be distributed at any heightalong the datacenter component rack 106 and still capable of connectingto one or more manifolds 110 used for transporting liquid for coolingthe datacenter electronic components 102, 104, and 124. For example, onemanifold 110 may be a delivery manifold, while the other manifold may bea return manifold 110, i.e., one manifold 110 may be for hot or heatedcoolant returning to a heat exchanger 116 from the datacenter electroniccomponents 102, 104, and 124, and a second manifold 110 may be for acold line, coolant exiting the heat exchanger 116 to be used for coolingthe datacenter electronic components 102, 104, and 124. The data centerelectronic components may be, for example, servers, JBODs, networkswitches, automatic transfer switches (ATSes), power distribution units(PDUs), or any other electronic equipment that is mountable in a serverrack.

Manifolds 110 can be disposed on and/or in the datacenter component rack106. The manifold(s) 110 connect to a heat exchanger 116. The heatexchanger 116 may be part of the datacenter component rack system 100 ormay be positioned remotely of the datacenter component rack system 100and connected to the manifolds through pipes and/or tubing (not shown).The heat exchanger 116 circulates coolant through the datacentercomponent rack system 100 in addition to transferring heat from thecoolant to the environment or some other location. The manifolds 110 maybe made of a non-corrosive material such as stainless steel to reducecontamination to the coolant within the manifolds 110 and extend thelife of the manifolds 110. In some other examples, the manifolds 110 maybe made of a non-reactive plastic tubing e.g., cross-linked polyethylene(PEX) tubing, a copper tubing, a brass tubing, and/or other suchmaterial. In some examples, the manifold 110 may be a composite ofmultiple materials, such as a stainless steel tube having a membrane orthinned portion formed from PEX through which the self-installingconnector 114 may puncture more easily than through stainless steel. Forinstance, the manifold 110 may have a non-uniform wall thickness, with awall thickness in a portion of the manifold 110 facing and/or directedtowards the datacenter electronic component 102 and/or positioned tocontact the self-installing connector 114 thinner than a remainder ofthe wall thickness. This results in a manifold 110 which may bepunctured by the self-installing connector 114 with less effort.

The datacenter component rack system 100 includes data connections 118as well as a power trunk 108. The data connections 118 includeconnectors to interface with the datacenter electronic components 102,104, and 124 at data ports 120 (e.g., FIG. 2) and provide a conduit fortransmitting data in accordance with the function of the datacenterelectronic components 102, 104, and 124. Suitable examples of types ofthe data connections 118 may include pluggable optical transceivers(such as small form-factor pluggable (SFP), enhanced small form-factorpluggable (SFP+), compact small form-factor pluggable (CSFP), or othervariations such as QSFP, QSFP+, QSFP28, QSFP56, QSFP56-DD, or OSFP),interconnect interfaces (such as Ultra path Interconnect (UPI),peripheral component interconnect express (PCIE), an RJ45 connector typeor a similar connector type, or a connector sized and arranged to meetany other suitable standards that may be known in the art. The powertrunk 108 includes electrical connections to interface with thedatacenter electronic components 102, 104, and 124 and specifically withelectrical connections 122 (e.g., FIG. 2) to provide electrical power tothe datacenter electronic components 102, 104, and 124. The power trunk108 may be adjustable and/or include connections that allow the varyingsizes and positioning of datacenter electronic components 102, 104, and124 described herein.

The datacenter electronic components 102, 104, and 124 include a liquidcooling system 112 which uses a coolant to remove heat from components,such as processors, of the datacenter electronic components 102, 104,and 124 to prevent overheating and damage to the components. The liquidcooling system 112 includes tubing and may include passive heatexchangers and/or heat sinks through which coolant flows to remove heatfrom the datacenter electronic components 102, 104, and 124. At the rearof the datacenter electronic components 102, 104, and 124, the liquidcooling system 112 terminates at self-installing connectors 114 (e.g.,FIG. 2) which couple the liquid cooling system 112 to the manifolds 110.

The self-installing connector 114 may initially be connected to adatacenter electronic component 102 before the component 102 is placedinto the rack 106. The self-installing connector 114 includes twocouplings, a component coupling 154 and a manifold coupling 140. Afterinstallation, the component coupling 154 will remain connected to thedatacenter electronic component 102 while the manifold coupling 140 willbe connected to the manifold 110 and the manifold coupling 140 and thesever coupling 154 may disconnect from the manifold coupling 140 if thedatacenter electronic component 102 is removed from the datacentercomponent rack. At the connection of the two couplings, theself-installing connector includes a dripless quick-disconnect coupling.Both couplings of the self-installing connector 114 are initially, priorto installation of the datacenter electronic components 102, 104, and124 into the datacenter component rack 106, attached to the rear of thedatacenter electronic components 102, 104, and 124. As the datacenterelectronic component 102 is installed into the datacenter component rack106, the self-installing connector 114 comes into contact with themanifold 110. The self-installing connector 114 punctures the manifold110 and is pushed into the manifold 110 as the datacenter electroniccomponent 102 is seated in a final installed position in the datacentercomponent rack 106. After installation of the datacenter electroniccomponent 102, the self-installing connector 114 may disconnect at thequick-disconnect coupling when the datacenter electronic component 102is removed from the installed position for maintenance and/or otherwork. The self-installing connector 114 is described in further detailwith respect to FIG. 3 below.

FIG. 2 illustrates a detail view of a rear portion of the datacentercomponent rack and components of FIG. 1 showing self-installingconnectors 114. As shown in FIG. 2, datacenter electronic component 102is shown during installation, before being fully seated in its finalposition. The self-installing connector 114 attached to datacenterelectronic component 102 has not yet punctured the manifold 110 andincludes both portions of the quick-disconnect coupling (e.g., as shownin FIG. 4). Datacenter electronic component 124 and larger datacenterelectronic component 104 are shown in their final installed position onthe datacenter component rack 106, and the self-installing connectors114 for those datacenter electronic components 104 and 124 couple theliquid cooling system 112 to the manifold 110 (e.g., as shown in FIG.5).

As datacenter electronic component 102 is inserted into a slot of thedatacenter component rack 106, the self-installing connector 114 willcontact the manifold 110 at a weakened portion 115 of the manifold wall.In some examples, the weakened portion 115 may be circular in shape andinclude a thinned wall and/or a partial cut-out or notch. The weakenedportion 115 may also have other non-circular shapes such as a square,oval, or any other suitable shape to allow the self-installing connector114 to cut out or knock out the weakened portion 115. The leading edgeof the self-installing connector 114 includes a cutting edge configuredto puncture the manifold 110 and create an opening into which theself-installing connector 114 will be inserted as the datacenterelectronic component 102 is installed. This configuration allowsblind-mating of the self-installing connector 114 after installation, inother words, the self-installing connector 114 does not need to beseparately connected to the manifold in addition to installing thedatacenter electronic component 102 on the datacenter component rack106. The action of installing the datacenter electronic component 102into the datacenter component rack 106 simultaneously results in theself-installing connector 114 puncturing the manifold 110 to create anopening and installing the self-installing connector 114 into the newlyformed opening, where the manifold coupling 140 of the self-installingconnector 114 is retained, forming a quick-disconnect coupling betweenthe datacenter electronic component 102 and the manifold 110.

Turning now to FIG. 3, a section view of a self-installing connectorinserted into the manifold 110 is shown. The manifold coupling 140 mayalternatively be installed on the datacenter electronic component 102,with a component coupling 154, which is a portion of the self-installingconnector 114, installed on the manifold 110. The manifold coupling 140includes a coupling surface 144 which may include a driplessquick-disconnect coupling as described herein. The manifold coupling 140also includes a seal 148, a cutting edge 150, a retainer 152, and amounting plate 146. The manifold coupling 140 defines a passage 142which provides a fluid connection to the liquid cooling system 112 fromthe manifold 110 when the datacenter electronic component 102 isinstalled on the datacenter component rack 106.

The self-installing connector 114, including the manifold coupling 140and the component coupling 154, may be formed of a material matching thematerial forming the manifold. In some other examples, theself-installing connector 114 is made from a non-corrosive material suchas stainless steel. The self-installing connector 114 may, in some otherexamples, be formed from a nickel plated metal, brass, anodizedaluminum, and/or various polymers. The self-installing connector 114,just as the manifolds 110, should be corrosion resistant to extend thelife of the liquid coolant system and components thereof.

The cutting edge 150 shows a sharpened edge configured to punctureand/or cut through the manifold 110 to create an opening for theself-installing connector 114. The cutting edge may be configured tomatch up with a series of weakened portions (not shown) of the manifold110, such that as the self-installing connector 114 is pressed againstthe manifold 110, the weakened portion (e.g., a punch-out) may give wayto form an opening in the manifold 110. The weakened portion may form acircular shape, or may include a portion of the manifold 110 nearest tothe datacenter electronic component 102. The weakened portion may, insome examples, be configured to allow varying placement and/orpositioning of the self-installing connector 114 along the height of themanifold 110 to accommodate the varying sizes and placement ofdatacenter electronic components 102, 104, and 124 as described herein.

As an illustrative example, the manifolds 110 may have a thinner wall onthe portion of the manifolds 110 facing the datacenter electroniccomponents 102, 104, and 124 which allows the self-installing connector114 to puncture the wall of the manifold 110 more easily. Other examplesmay include a series of grooves and/or incisions made in the manifold110 along the length of the manifold 110 where the self-installingconnector 114 will contact and puncture the manifold 110. The series ofgrooves may extend through the majority of the thickness of the wall ofthe manifold 110 such that contact with the self-installing connector114 results in an inner section surrounded by the grooves beingdisplaced or punched out, forming an opening in the wall of the manifold110.

In some other examples, the cutting edge 150 may be configured topuncture and deform the manifold 110. For example, the cutting edge 150may include a sharp point or surface. The cutting edge may also form orcut threads for a threaded connection into the wall of the manifold 110.For example, the cutting edge 150 may include a spring-loaded orotherwise driven element that causes rotation of the thread cuttingdevice as the cutting edge 150 proceeds to puncture and pass through themanifold 110.

The retainer 152 is designed to resist removal of the manifold coupling140 after insertion into the manifold 110. The retainer 152 is shown asa series of radial barbs which surround the manifold coupling 140 aroundthe portion to be inserted into the manifold 110, including the portionbetween the cutting edge 150 and the mounting plate 146, which preventsover-insertion of the self-installing connector 114 into the manifold110. The barbs of the retainer 152 may have a thin fin shape and beangled and/or directed away from the cutting edge 150 such that theretainer 152 will not prevent insertion of the manifold coupling 140into the manifold 110. After the self-installing connector 114 isinserted into the manifold 110, the retainer prevents removal of themanifold coupling 140 by having the barbs contact the manifold 110 onthe inner surface of the manifold and due to the barb shape, spread outif force is applied to remove the manifold coupling 140, preventingremoval.

In some examples, the retainer 152 may be a threaded connection,particularly in examples incorporating a thread cutter with the cuttingedge 150 as described herein. The manifold coupling 140 may be threadedinto the newly cut threads cut by the cutting edge 150 through the useof a pre-tensioned torsion spring or other rotational device.

In some further examples, the retainer may include an adhesive, e.g., anair activated adhesive such as cyanoacrylate adhesive. Other adhesivesmay also function as a retainer including a two part epoxy, a contactadhesive, or any other suitable adhesive for securing the manifoldcoupling 140 to the manifold 110. For instance, to be suitable, theadhesive must be compatible with the material forming the manifold 110and the self-installing connector 114. Other securing devices andmethods of securing known to those with skill in the art are anticipatedand may be incorporated herein.

The retainer 152 may, in some examples, include radial barbs asdescribed above as well as an adhesive. For example, the radial barbsmay have an adhesive disposed in a space between adjacent radial barbs.As the self-installing connector 114 punctures the manifold 110, thebarbs of the retainer 152 may compress to insert into the opening formedin the manifold 110. As the barbs compress, the adhesive disposedbetween the barbs is displaced and/or squeezed out of the inter-barbspace. The adhesive may include any of the adhesives described above. Inone example, the adhesive may include a two part epoxy, with the twocomponents disposed in adjacent inter-barb spaces. As the barbs arecompressed during installation, the two components of the epoxy aresqueezed out of the inter-barb space and come into contact with eachother, activating the epoxy for adhesion. In at least this example, theadhesive is therefore both activated and applied by the action ofinstalling the datacenter electronic component 102.

FIG. 4 shows aside view of the self-installing connector 114 of FIG. 3before insertion into the manifold 110. The manifold 110 is shown havinga weakened portion 111, though other shapes, configurations, or designsof manifold 110 described herein are suitable. The self-installingconnector 114 includes a component coupling 154 and a manifold coupling140. The component coupling 154 and the manifold coupling 140 form adripless quick-disconnect coupling. The manifold coupling 140 and thecomponent coupling 154 may be blind-mating connections, i.e., thecomponent coupling 154 and the manifold coupling 140 are engaged uponinsertion of the datacenter electronic component 102 into the datacentercomponent rack 106. The quick-disconnect coupling may be of any type orvariety available, including but not limited to a non-latching coupling,a double shut-off, single shut-off, and/or dripless connections. Thosewith skill in the art will appreciate the broad scope and availabilityof quick-disconnect couplings and therefore this description is intendedto incorporate such couplings.

In some examples, a flat-faced coupling may be incorporated into theself-installing connector 114. Flat-faced couplings can virtuallyeliminate spillage by limiting leakage to a drop of fluid or less upondisconnection. The flat mating surfaces are also easy to keep clean,which prevents contaminating coolant reconnection. Flat-face, no-spillcouplings, often include a poppet-style shutoff valve on each matinghalf Most limit leakage during uncoupling to only a drop or less on thecoupling's mating surfaces and prevent air ingression during coupling.They are also designed for minimum flow restriction, which minimizespressure drop during equipment operation. In some examples, thepoppet-style shutoff may be incorporated or included with other types ofcouplings, including non-latching couplings. Non-latching couplings aretypically used in applications where quick serviceability in a compactspace is required. Typically, a non-latching quick disconnect will beselected when a portion of the device requires frequent change out, whenthe releasing sleeve of a latching coupling may be inaccessible. Oftenthese couplings are equipped with self-sealing valves so that upondisconnection they will automatically contain the fluid in at least oneof the lines. Snap type quick disconnects are commonly specified with noshut-off, a single shut-off, double shut-off, or as a dry break.

The manifold coupling 140 may include a seal 148 or O-ring to preventleaks or coolant loss around the opening formed in the manifold 110. Thequick-disconnect coupling may also incorporate sealing materials, suchas O-ring seals. Buna (also known as Buna-N or Nitrile) offerscompatibility with the majority of coolant types. In some otherexamples, ethylene propylene diene monomer rubber (EPDM), Viton®,Silicone and Perfluoroelastomers (such as Chemraz® and Kalrez®) may beincorporated. The mounting plate 146 may provide a surface against whichthe seal 148 may press to seal the opening in the manifold 110. In someother examples, the seal 148 may be replaced, either partially orwholly, by an adhesive such as epoxy used to retain the manifoldcoupling 140 in the manifold 110.

FIG. 5 shows a side view of the self-installing connector 114 of FIGS. 3and 4, advanced so that the self-installing connector 114 is insertedinto the manifold 110. The self-installing connector 114, including themanifold coupling 140 and the component coupling 154, is coupled to thedatacenter electronic component 102 and the liquid cooling system 112.The self-installing connector 114 is further coupled to the manifold110. The self-installing connector 114 provides fluid communicationbetween the manifold 110 and the liquid cooling system 112.

In some examples, as the self-installing connector 114 punctures themanifold 110, it may knock out a punch-out portion of the manifold 110as described above. The punch-out, or debris that is produced as aresult of the installation of the self-installing connector 114 may beloose inside the manifold 110. The debris may need to be removed fromthe manifold 110 before operation commences to prevent plugging portionsof the liquid cooling system 112, self-installing connectors 114, orother portions of the system resulting in malfunctions. The manifold 110may therefore include a clean-out or debris trap at a lower end of themanifold 110 into which the debris may settle and be removed. Themanifold 110 may also include a gas purge vent or valve at an upper endto remove air from the manifolds 110 that may be introduced duringinstallation and may interfere with operation of the liquid coolingsystem 112.

In some examples, the liquid cooling system 112 may also include aliquid connection notification system (not shown). The liquid connectionnotification system may include liquid and/or coolant sensors such asconductive sensor and/or moisture sensors such that when a successfulfluid connection is formed between the manifold 110 and the liquidcooling system 112, a notification such as a light or audible tone isgenerated indicating the connection to the liquid cooling system 112 issuccessful. The notification system may prevent instances where thedatacenter electronic component 102 is installed in a datacentercomponent rack 106 but is installed incorrectly or there is amalfunction in the liquid cooling system 112 but the installer isunaware until the datacenter electronic component 102 overheats inoperation, resulting in damage to the datacenter electronic component102 and potentially to additional adjacent units.

In some examples, the self-installing connector 114 may provide anotification that it is properly installed and/or fully seated in themanifold 110. For example, the self-installing connector 114 may providean audible click or tone to indicate to an installer that the datacenterelectronic component 102 is fully seated and the self-installingconnector 114 is fully seated in the manifold 110 to provide a leak-freefluid connection between the liquid cooling system 112 and the manifold110.

In some further examples, the datacenter component rack system 100includes telemetry and/or pressure sensors to provide readings ofpressure levels within the manifolds 110. The telemetry may beconfigured to interface with a cooling control system which lowers thepressure within the manifolds 110 to allow installation of thedatacenter electronic components 102, 104, and 124 using theself-installing connector 114 with a decreased risk of coolant leaks atthe point in time the self-installing connector 114 punctures themanifold 110.

The specification and drawings are, accordingly, to be regarded in anillustrative rather than a restrictive sense. It will, however, beevident that various modifications and changes may be made thereuntowithout departing from the broader spirit and scope of the disclosure asset forth in the claims.

FIG. 6 illustrates a side view of the self-installing connector 114 ofFIG. 5, with a component coupling 154 retracted so that the manifoldcoupling 140 is disconnected at a quick-disconnect connector afterinsertion into the manifold 110. The component coupling 154 and themanifold coupling 140 connect using a blind-mate quick-disconnectcoupling as described herein. After the self-installing connector 114 isinstalled, with the manifold coupling 140 secured in the manifold 110,the datacenter electronic component 102 may be removed for maintenanceand/or other purposes such as replacement. Upon removal of thedatacenter electronic component 102, the quick-disconnect joint betweenthe manifold coupling 140 and the component coupling 154 separates,disconnecting the fluid communication between the manifold 110 and theliquid cooling system 112. The retainer 152 resists removal of themanifold coupling 140 from the manifold 110, ensuring the disconnectionoccurs at the quick-disconnect joint. Upon re-insertion of thedatacenter electronic component 102 into the datacenter component rack106, the component coupling 154 will automatically re-connect with themanifold coupling 140 at the blind-mate quick-disconnect joint, whichmay also be a dripless connection as described above.

Other variations are within the spirit of the present disclosure. Thus,while the disclosed techniques are susceptible to various modificationsand alternative constructions, certain illustrated embodiments thereofare shown in the drawings and have been described above in detail. Itshould be understood, however, that there is no intention to limit thedisclosure to the specific form or forms disclosed, but on the contrary,the intention is to cover all modifications, alternative constructions,and equivalents falling within the spirit and scope of the disclosure,as defined in the appended claims.

The use of the terms “a” and “an” and “the” and similar referents in thecontext of describing the disclosed embodiments (especially in thecontext of the following claims) are to be construed to cover both thesingular and the plural, unless otherwise indicated herein or clearlycontradicted by context. The terms “comprising,” “having,” “including,”and “containing” are to be construed as open-ended terms (i.e., meaning“including, but not limited to,”) unless otherwise noted. The term“connected” is to be construed as partly or wholly contained within,attached to, or joined together, even if there is something intervening.Recitation of ranges of values herein are merely intended to serve as ashorthand method of referring individually to each separate valuefalling within the range, unless otherwise indicated herein and eachseparate value is incorporated into the specification as if it wereindividually recited herein. All methods described herein can beperformed in any suitable order unless otherwise indicated herein orotherwise clearly contradicted by context. The use of any and allexamples, or exemplary language (e.g., “such as”) provided herein, isintended merely to better illuminate embodiments of the disclosure anddoes not pose a limitation on the scope of the disclosure unlessotherwise claimed. No language in the specification should be construedas indicating any non-claimed element as essential to the practice ofthe disclosure.

Disjunctive language such as the phrase “at least one of X, Y, or Z,”unless specifically stated otherwise, is intended to be understoodwithin the context as used in general to present that an item, term,etc., may be either X, Y, or Z, or any combination thereof (e.g., X, Y,and/or Z). Thus, such disjunctive language is not generally intended to,and should not, imply that certain embodiments require at least one ofX, at least one of Y, or at least one of Z to each be present.

Embodiments of this disclosure are described herein, including the bestmode known to the inventors for carrying out the disclosure. Variationsof those embodiments may become apparent to those of ordinary skill inthe art upon reading the foregoing description. The inventors expectskilled artisans to employ such variations as appropriate and theinventors intend for the disclosure to be practiced otherwise than asspecifically described herein. Accordingly, this disclosure includes allmodifications and equivalents of the subject matter recited in theclaims appended hereto as permitted by applicable law. Moreover, anycombination of the above-described elements in all possible variationsthereof is encompassed by the disclosure unless otherwise indicatedherein or otherwise clearly contradicted by context.

What is claimed is:
 1. A self-installing connector for a liquid coolingsystem of an electronic component, the self-installing connectorcomprising: a component coupling comprising: a component-couplingquick-disconnect portion; a component-coupling connection portion; and acomponent-coupling fluid conduit, wherein the component-couplingconnection portion is configured for attachment to the electroniccomponent, and wherein the component-coupling fluid conduit isconfigured for conveyance of a cooling liquid through the componentcoupling and the electronic component; and a manifold couplingcomprising: a manifold-coupling quick-disconnect portion; amanifold-coupling connection portion; and a manifold-coupling fluidconduit, wherein the manifold-coupling connection portion is configuredfor penetration through a wall of the manifold to attach and retain themanifold coupling to the manifold and place the manifold-coupling fluidconduit in fluid communication with the manifold, wherein thecomponent-coupling fluid conduit is configured for conveyance of thecooling liquid through the manifold and the component-coupling fluidconduit, and wherein the manifold-coupling quick-disconnect portion isconfigured for releasably coupling with the component-couplingquick-disconnect portion to place the component-coupling fluid conduitin fluid communication with the manifold-coupling fluid conduit.
 2. Theself-installing connector of claim 1, wherein the self-installingconnector establishes a fluid connection between the manifold and theelectronic component when the electronic component is inserted into anelectronic component rack.
 3. The self-installing connector of claim 1,wherein the manifold-coupling connection portion comprises barbsconfigured to resist removal of the manifold coupling from the wall ofthe manifold after insertion.
 4. The self-installing connector of claim3, wherein the manifold-coupling connection portion further comprises anadhesive disposed between adjacent barbs configured to be displaced asthe self-installing connector is installed in the wall of the manifoldand thereby secure the manifold-coupling connection portion to themanifold.
 5. The self-installing connector of claim 1, wherein themanifold-coupling connection portion comprises a thread cutterconfigured to form threads in the wall of the manifold.
 6. Theself-installing connector of claim 5, wherein the manifold-couplingconnection portion comprises a threaded connection.
 7. Theself-installing connector of claim 1, wherein the manifold-couplingconnection portion forms an opening in the wall of the manifold when theelectronic component is installed into an electronic component rack. 8.The self-installing connector of claim 1, wherein the manifold-couplingconnection portion comprises an adhesive configured to bond the manifoldcoupling to the manifold.
 9. The self-installing connector of claim 1,wherein the manifold coupling comprises an o-ring for sealing theself-installing connector against the manifold.
 10. The self-installingconnector of claim 1, wherein the manifold-coupling quick-disconnectportion and the component-coupling quick-disconnect portion releasablycouple at a fluid-tight connection.
 11. A self-installing connector,comprising: a first coupling comprising: a first quick-disconnectcoupling portion; a first component coupling portion that couples to afirst component of a liquid cooling system; and a first fluid conduit,wherein the first quick-disconnect coupling portion and the firstcomponent coupling portion are fluidly connected through the first fluidconduit; a second coupling comprising: a second quick-disconnectcoupling portion, the second quick-disconnect coupling portionreleasably coupleable with the first quick-disconnect coupling portion;a second component coupling portion that couples to a second componentof the liquid cooling system, the second component coupling portioncomprising: a cutting portion that penetrates a surface of the secondcomponent of the liquid cooling system to establish a fluid conduitbetween the first component of the liquid cooling system and the secondcomponent of the liquid cooling system; and a retaining portion thatretains the second component coupling portion in fluid communicationwith the second component; and a second fluid conduit, wherein thesecond quick-disconnect coupling portion and the second componentcoupling portion are fluidly connected through the second fluid conduit.12. The self-installing connector of claim 11, wherein the retainingportion comprises an adhesive configured to bond the second componentcoupling portion to the second component.
 13. The self-installingconnector of claim 11, wherein the retaining portion comprises barbedflanges.
 14. The self-installing connector of claim 13, wherein thebarbed flanges comprise radial flanges which angle away from the cuttingportion.
 15. The self-installing connector of claim 14, wherein theretaining portion comprises a two part adhesive, with components of thetwo part adhesive positioned around adjacent annular flanges such thatdeflection of the radial flanges causes the two part adhesive to mixtogether to secure the second component coupling portion to the secondcomponent.
 16. The self-installing connector of claim 11, wherein theretaining portion comprises a series of barbs positioned along a lengthof the second coupling.
 17. The self-installing connector of claim 11,wherein the self-installing connector defines a fluid connection betweenthe first component and the second component when the firstquick-disconnect coupling portion and the second quick-disconnectcoupling portion are secured together.
 18. The self-installing connectorof claim 11, wherein the retaining portion and the first componentcoupling portion each comprise threaded connections.
 19. Theself-installing connector of claim 11, wherein the firstquick-disconnect coupling portion and the second quick-disconnectcoupling portion comprise blind-mate connections.
 20. Theself-installing connector of claim 11, wherein the second componentcoupling portion comprises an insertion stop to halt insertion of thecutting portion into the surface of the second component when fullyinserted.